Applied Materials, Inc. unveiled its Applied UVision 5 wafer inspection system for detecting defects in the critical patterning layers of logic devices at the sub-20nm node. The system’s deep ultra-violet (DUV) laser and simultaneous brightfield and greyfield light collection capabilities deliver up to double the light intensity to the wafer over previous tools, enabling the UVision 5 system to capture up to twice the number of killer defects. This unmatched sensitivity allows semiconducto...